Semiconductor cassette dimension inspection device "FSM Series"
Aiming for a new standard in semiconductor peripheral equipment inspection! We will shorten the takt time through wide-field imaging.
The "FSM Series" is a device that measures the outer diameter dimensions of FOUP/FOSB/OC. With a 25-megapixel camera and a dedicated optical engine, it enables ultra-high-quality outer diameter measurements. It measures and inspects the top flange, side fork lift flange, step pitch for wafer mounting, and registration pinholes from various angles. Custom orders are also available. Please feel free to consult us. 【Features】 ■ Compatible with FOUP/FOSB/OC from various manufacturers ■ Capable of inspecting sizes other than the standard φ300mm and color cassettes ■ Enables ultra-high-quality outer diameter measurements with a 25-megapixel camera and dedicated optical engine ■ High-speed processing with an ultra-wide field of view achieves industry-leading throughput ■ Custom orders are also available *For more details, please refer to the PDF document or feel free to contact us.
- 企業：清和光学製作所
- 価格：Other
